Introduction
Glass wafers are used in a number of applications as an alternative or tandem with silicon wafers. BK7 is a high-quality optical glass that is used if the additional benefits of fused silica are not required in an application. BK7 performs well in all chemical tests, and no additional or special handling is required unlike silicon glasses, hence it is cost-effective from the manufacturing point of view. It is a relatively hard material with extremely low bubble and inclusion content, but it offers excellent transmittance throughout the visible and near-infrared spectra and down to 350 nm in the ultraviolet. Also, BK7 optical glass is used for all standard optical glass components, or when the optical glass is generically requested for custom elements.
Wafer grinding or wafer thinning is a process performed to reduce wafer thickness. Grinding or thinning is a highly intricate process that requires specialized equipment and procedures. BK7 Optical Glass which is used in the optical spectrum requires higher precision, hence precision grinding.
Fine Grinding of BK7 Glass
SQUADRO-G diamond grinding pad is an ideal solution that provides consistent fine grinding or thinning of glass wafers to Ra 0.10 μm. SQUADRO-G 30 micron B4E7Q diamond grinding pad allows for consistent grinding of BK7 glass wafers over many cycles.
Low Maintenance, Higher Precision
The consistent fine grinding of BK7 glass wafers requires brief and gentle conditioning of the SQUADRO-G 30-micron pad, for example with brass brushes. Regular conditioning removes abraded material and prevents the glazing of the grinding pad surface. The corresponding surface quality remains stable over the respective cycles.
The precision can be further improved by combining SQUADRO-G grinding pad with SQUADRO-LUB-G lubricant to achieve higher results. After the initial preparation and dressing of the SQUADRO-G 30-micron pad, the material removal rate is in the range of 25 to 35 μm/min.
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